• Reverse engineering a high-end soldering station

      (This is the translation of the original article performed by baragol)

      We had a bunch of photographs of the main PCB, a YouTube video with drain-voltage waveforms of MOSFETs, a forum post with a breakdown of the capacitance values of LC circuit capacitors and also a number of unboxing videos showing the heating-up of the soldering tip. The only thing that really worried me was the video with the measurement of the peak power consumption during the heating-up. There is nothing in the world more helpless and irresponsible and depraved than burned cartridge newly bought for 60 bucks from Amazon. But let me start from the beginning.
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    • System in Package, or What's Under Chip Package Cover?

        Transistor feature size is decreasing despite constant rumors about the death of Moore’s law and the fact that industry is really close to physical limits of miniaturisation (or even went through them with some clever technology tricks). Moore’s law, however, created user’s appetite for innovation, which is hard to handle for the industry. That’s why modern microelectronic products aren’t just feature size scaled, but also employ a number of other features, often even more complicated than chip scaling.

        Disclaimer: This article is a slightly updated translation of my own piece published on this very site here. If you're Russian-speaking, you may want to check the original. If you're English-speaking, it's worth noting that English is not my native language, so I'll be very grateful for the feedback if you find something weird in the text.
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