Хабр Курсы для всех
РЕКЛАМА
Практикум, Хекслет, SkyPro, авторские курсы — собрали всех и попросили скидки. Осталось выбрать!
собрала первый в истории полноценный компьютер (процессор)


METHODS SUMMARY
The fabrication process is depicted in Extended Data Fig. 1. The CNTs are grown
on a quartz substrate to yield highly aligned CNTs14, and are transferred onto the
target SiO2 wafer14. Before CNT transfer, the wafer undergoes processing to define
bottom-layer wires and the local back gates of the transistors28. Lithographically
defined trenches are etched using a combination of dry plasma etch followed by
wet etch, and are filled by electron-beam evaporation of platinum and smoothed
by a subsequent plasma sputter etch. A 24-nm high-k dielectric of Al2O3 is deposited
by atomic-layer deposition, and contact holes are etched through this layer to the
embedded metal wires and gates through another combined dry- and wet-etch
process. After CNT transfer, the source and drain (bilayers of palladium and pla-
tinum) are lithographically defined through a lift-off process, and mis-positioned
CNTs are etched away using optical lithography followed by oxygen plasma15. A
metal layer of gold is lithographically patterned with lift-off and connects every
other source and drain, and separately connects every gate, effectively forming a
single CNFET composed of all of the single CNFETs in parallel.
Первый процессор из углеродных нанотрубок